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KNB-S Series Sub-micron Bead Mill

What is bead mill?
Wet grinding bead mill is a kind of machine for ultra-fine processing of solids in liquids. High energy input through the grinding media to create strong shear and impact force to dispersing, disaggregating and homogenizing the particles in the slurry.
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KNB-S Series Sub-micron Bead Mill
KNB-S Series Sub-micron Bead Mill
KNB-S Series Sub-micron Bead Mill
KNB-S Series Sub-micron Bead Mill
KNB-S Series Sub-micron Bead Mill
KNB-S Series Sub-micron Bead Mill
KNB-S Series Sub-micron Bead Mill
KNB-S Series Sub-micron Bead Mill
Overview of Sub-micron Bead Mill

How to select a agitator bead mill, KEY points?
A. Flow rate of bead mill determines how long time the particles stay in the grinding zone,which affects the fineness of particles, output and particle size distribution.
B. Linear velocity of rotor determines the intensity of kinetic energy that transffered to the grinding media which affects the grinding efficiency, fineness of particles and wear loss of grinding media. 12-16 m/s is the generally operation speed.
C. Grinding media size selection is a key point, usually it is 1000 times of the target particle size. In theory, smaller the diameter of the beads is, more the contact point exists with smaller particle size achievements. However, It still depends on many factors like initial particle size. We need to choose the correct beads to fit different grinding requirements.
D. Generally, the grinding media filling rate is higher, the grinding efficient is higher. And the range of filling rate is around 75%-90% according to the viscosity of products. If too much higher will cause sieve blocking and high temperature problem.
E. Bulk density of grinding media-higher the bulk density will create stronger shear and impact force in the movement , better grinding efficiency it is.
F. Gap of separation screen is usually 1/2-1/4 times of the grinding media diameter. If the particle initial size is much bigger, it may block the sieve, hence, we need to consider two stage grinding process

Technical Parameters of Sub-micron Bead Mill

Technical Data Of Sub-micron Bead Mill

  • Initial particle size :<100um.
  • After ground :0.1- 10um.
  • Solvent : water-base,oil-base.
  • Viscosity :<40000CPS
  • Grinding media size:0.1- 2.0mm
  • Rotor material : Zirconia, Silicon carbide, Tungsten Carbide , PU, Alloyed steel.
  • Inner vessel material : Zirconia, Silicon carbide, Tungsten Carbide, PU, Alloyed steel.

 

Specifications & Technical Of Sub-micron Bead Mill

 

Model Active Volume Power

(KW)

Batch Size

(L)

Media size

(mm)

Weight

(kgs)

Dimensions

(mm)

KNB-S-0.3L 0.3L 2.2 0.3-5 0.1-2.0 60 500*450*650
KNB-S-0.5L 0.5L 5.5 1.5-10 0.1-2.0 170 1020*780*840
KNB-S-0.6L 0.6L 5.5 1.5-10 0.1-2.0 175 1020*780*840
KNB-S-1L 1L 5.5 3-20 0.1-2.0 190 1020*780*840
KNB-S-3L 3L 11 5-100 0.1-2.0 400 1300*900*1750
KNB-S-6L 6L 18.5 20-200 0.1-2.0 550 1300*900*1750
KNB-S-10L 10L 22 30-300 0.1-2.0 1300 1300*900*1750
KNB-S-25L 25L 37 75-1000 0.1-2.0 1700 1900*1500*1700
KNB-S-30L 30L 37/45 80-1000 0.1-2.0 1900 1900*1500*1700
KNB-S-60L 60L 75/90 200-2000 0.1-2.0 3600 2100*1650*1900
KNB-S-100L 100L 110 300-4000 0.1-2.0 5600 2400*1650*2200
KNB-S-150L 150L 185 500-6000 0.1-2.0 6800 2600*165082300
KNB-S-400L 400L 355 1000-10000 0.1-2.0 10500 4000*1900*2900
Work Principle of Sub-micron Bead Mill
01.Crushing
Grinding is high energy input through grinding media to create strong impact and shear force in grinding zone, that makes the particles' size reduced and enlarge the specific surface of solid contents
02.Disaggregating
Disaggregating happens during the grinding process, that divide the big aggregates into small particles
03.Homogenizing
Homogenizing keep the fine particles to stay in a stable and uniform distribution in the slurry
Features of Sub-micron Bead Mill
Features of Sub-micron Bead Mill
  • The whole system controlled by PLC and industrial computer,to realize the intelligent process control from raw material feeding, pre-mixing, ultra fine grinding ,filtration, iron-removal,spray drying and canning pack.
  • Interface touch screen display and monitor the running status of the whole system.
  • Pre-setting different grinding program recipe to realize switch grinding process easily.
  • Automatic store and analysis the running data
  • High precision sensors and gauges keeps the stability and safety operation
  • To save labor cost, improve efficiency and create more benefits to our customers
Features Of Sub-micron Bead Mill
  • Adapt to 0.1- 0.2mm grinding meida,suitable for ultrafine grinding above 100nm.
  • Rotor design according to fluid mechanics and simulation,the gap between rotor and vessel is 7-12mm to guarantee.
  • High efficiency and narrow particle size distribution.
  • With large surface screen separation system to prevent blocking problem.
  • Cooling system design according to principles of helical stereo thermal and fluid mechanics to guarantee effective temperature control.
  • Advanced mechanical seal technology to prevent the loss of leakage.
  • Pressure and temperature automatic safety protection device.
  • Optional products contact material to meet different grin ding requirements.
  • Touch screen or PLC control panel, easy for operation.

 

 

Application of Sub-micron Bead Mill

Comparison between bead mill and ball mill

 

General Applications
New energy_Lithium-ion battery, lsilicon carbon, graphene, carbon nanotubes, alumina membrane slurry, PVDF membrane slurry, etc.
Powder_Alumina, Zirconia, Silicon Carbide, Titanium Dioxide, Calcium Carbonate, Silicon Materials, Cerium oxide, Zinc oxide, Barium Titanate, MLCC, Boron Nitride, Boron carbide, magnetic materials, etc.
Chemical_Automotive coating, furniture paint, anticorrosive paint, special paint, color paste, ceramic ink, UV ink, glass ink,offset ink, cosmetics, pharma , food, agriculture and others to provide a complete set of solutions.

Automatic production line platform

 

 

 

 

KNB-S Series Of Sub-micron Bead mill

Applications of Sub-micron Bead mill

Silicon carbon anode, cathode materials, polishing fluid (alumina, zirconia, cerium oxide, etc.), graphene, color paste, printing ink, electronic ceramics, etc.

 

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